Dr. CP Wong's group is
recruiting undergrads for electronic packaging and energy materials projects.
If interested, please email chiachituan@gatech.edu and bsong5@gatech.edu with a resume and a brief description of
yourself and area(s) of interest. The positions are for credit (2-3 hours of
undergrad research), and are to begin in spring 2015.
Underfills for advanced IC packaging
In IC packages, polymer-based underfill materials are used to redistribute the thermal mechanical stresses in the interconnects. As package sizes shrink, new underfilling schemes are developed, which brings about new processing and material challenges, such as the issue of filler trapping in no-flow underfills. In the processing aspect, we will span a range of processing parameters for condition optimization, and in the materials aspect, we will develop underfill formulations that satisfy requirements posed by interconnect bonding conditions and package reliability considerations. This project involves chemical modification, composite formulation, curing kinetics, rheology, and superhydrophobic surfaces.
Encapsulant for high brightness LED packaging
In LED packages, the sharp contrast between the refractive indices of the chip and air causes much internal reflection and light trapping in the package, which in turn leads to heat dissipation and reduced device lifetime. We are developing a silicone-based encapsulant material with intermediate refractive index to increase light extraction from the package. This project involves nanoparticle synthesis, chemical modification, composite formulation, and optical characterizations.
In addition to the projects described above, we're also recruiting undergrad researchers to work on energy storage materials and perovskite solar cells.
Underfills for advanced IC packaging
In IC packages, polymer-based underfill materials are used to redistribute the thermal mechanical stresses in the interconnects. As package sizes shrink, new underfilling schemes are developed, which brings about new processing and material challenges, such as the issue of filler trapping in no-flow underfills. In the processing aspect, we will span a range of processing parameters for condition optimization, and in the materials aspect, we will develop underfill formulations that satisfy requirements posed by interconnect bonding conditions and package reliability considerations. This project involves chemical modification, composite formulation, curing kinetics, rheology, and superhydrophobic surfaces.
Encapsulant for high brightness LED packaging
In LED packages, the sharp contrast between the refractive indices of the chip and air causes much internal reflection and light trapping in the package, which in turn leads to heat dissipation and reduced device lifetime. We are developing a silicone-based encapsulant material with intermediate refractive index to increase light extraction from the package. This project involves nanoparticle synthesis, chemical modification, composite formulation, and optical characterizations.
In addition to the projects described above, we're also recruiting undergrad researchers to work on energy storage materials and perovskite solar cells.
--
Chia-Chi Tuan
Graduate
Research Assistant
Microelectronic
and Photonic Packaging Materials Group
School
of Materials Science & Engineering
Georgia Institute of Technology
