IBM GP8V Summer CO-OP Opportunity
The project involves developing micro Raman procedures for analysis of semiconductors and semiconductor manufacturing processes. Some of the methods that need to be developed are thin film analysis (Strained silicon, Silicon Dioxide, Silicon Nitride, BPSG, etc.) and mask defect analysis. Raman methods used to monitor polyimide and photoresist curing, and other semiconductor manufacturing processes need to be investigated. The applicant will also make a Raman spectral library of different chemicals and materials used at the Burlington manufacturing facility. The candidate should be pursuing a degree in chemistry, physics, or material science and will perform their investigation under the supervision of a chemist(s) at the Burlington Fab.
For some additional information on our company:
we are presently part of IBM but may be transitioning to Global Foundries
ownership during the course of the internship. Our facility is a semiconductor
fabrication facility under the division of Microelectronics and produces chips
found in many cell phones including silicon germanium and silicon-on-insulator
chips. We are located in Burlington, Vermont. Some additional information on our
division is included below.
If interested in the intern position, please send a
resume or any questions to melydon@us.ibm.com or linmille@us.ibm.com.
Thanks,
Megan E. Lydon, Ph.D.
Chemistry Lab Engineer
Systems and Technology Group - Microelectronics Division
Phone: (802) 769-1125/ tie-line 446-1125
email: melydon@us.ibm.com
Chemistry Lab Engineer
Systems and Technology Group - Microelectronics Division
Phone: (802) 769-1125/ tie-line 446-1125
email: melydon@us.ibm.com
